Stimulating Transition for Advanced Microelectronics Packaging (STAMP)
The SHIP Program – also referred to as State of the Art Heterogeneous Integrated Packaging – is developing four prototype Multichip Packages (MCPs). Building off of the successful SHIP program, a pilot will be established to facilitate the transition of these MCPs to military systems by partnering with the Defense Industrial Base. The pilot program will be called Stimulating Transition for Advanced Microelectronics Packaging (STAMP).
This will be accomplished by leveraging alignment to existing DoD Programs to transition the MCP technology to a program of record system. Advantages for military system developers and integrators include:
Access to processing devices specifically designed in collaboration with DoD to meet DoD computing needs
Access to next-generation at-the-edge sensor computing designed in collaboration DoD
SOTA technologies will provide your systems with cutting-edge technology improvements – dramatically accelerating your technology roadmap of processing/computing devices with significantly reduced SWAP and increased performance
So if you want your company and programs to have access to the best commercial technologies for military applications with measurable security, please consider engaging with this opportunity.
Overview
The Navy desires to develop a state-of-the-art (SOTA) heterogeneous integrated packaging (SHIP) prototype to demonstrate enhanced fabrication and packaging access for the Department of Defense (DoD) programs. The primary objective of the SHIP prototype project will be to demonstrate a novel approach to a secure, assessable, and cost effective SOTA integrated, design, assembly, and test leveraging the expertise of commercial industry. In addition, a SHIP prototype will achieve less power consumption and latency, also reducing physical size, improving performance and reliability. Achieving the objective will require novel and innovative methods including unique and secure design tools, and intellectual property for multi-die heterogeneous integration of SOTA microelectronics. Secure SOTA fabrication, assembly, and test resources will also be developed to support successful demonstration of the SHIP prototype that is International Traffic in Arms Regulations (ITAR) compliant.
Awarded to: GE Research, Intel Federal, LLC., Keysight Technologies, Northrop Grumman Aerospace Systems, Qorvo, Xilinx
Would you like to work with the awardees? Points of Contact are listed for companies interested in being contacted by potential subcontractors & vendors.
Qorvo: Kirk Ashby, Research Program Manager, kirk.ashby@qorvo.com, (972) 994-3868
Keysight: Scott Scaramastro, Defense Technologies Manager, scott_scaramastro@keysight.com, (707) 577-6064
GE Research: Todd Miller, Commercial Director, millert@ge.com, (518) 387-4930
Intel Federal: Gena Gleason, Strategic Engagement Manager for Secure Microelectronics, gena.gleason@intel.com, (301) 526 1912.
Xilinx: Bill Allaire, Xilinx Aerospace & Defense System Architect, billa@xilinx.com, (408) 823-6987
Northrop Grumman Space Systems: Augusto Gutierrez-Aitken, Program Manager, augusto.gutierrez@ngc.com, (310)-812-5536
